Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354978 | Coupled loop and void structure integrated in a redistribution layer of a chip package | Po-Wei Chiu, Hong Shi, Li-Sheng Weng, Young-Soo Lee | 2025-07-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354978 | Coupled loop and void structure integrated in a redistribution layer of a chip package | Po-Wei Chiu, Hong Shi, Li-Sheng Weng, Young-Soo Lee | 2025-07-08 |