Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Yangyang SUN, Li-Sheng Weng | 2025-07-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Yangyang SUN, Li-Sheng Weng | 2025-07-08 |