Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198997 | Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients | Su Yun Kim, Dong Hoon OH, Yong Tae Kwon, Jun Kyu Lee, Kyeong Rok SHIN | 2025-01-14 |