Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12427346 | P62 ligand compound, and composition for preventing, ameliorating or treating proteinopathies comprising the same | Chang Hoon Ji, Srinivasrao Ganipisetti, Hee-Yeon Kim, Su Ran Mun, Chan Hoon Jung +2 more | 2025-09-30 |
| 12383624 | Cargo delivery system and composition comprising the same | Chang Hoon Ji, Srinivasrao Ganipisetti, Hee-Yeon Kim, Su Ran Mun, Chan Hoon Jung +9 more | 2025-08-12 |
| 12205904 | Wafer-level design and wiring pattern for a semiconductor package | Jun Kyu Lee, Dong Hoon OH, Su Yun Kim, Kyeong Rok SHIN | 2025-01-21 |
| 12198997 | Semiconductor package comprising first molding layer and second molding layer with different thermal expansion coefficients | Su Yun Kim, Dong Hoon OH, Jun Kyu Lee, Kyeong Rok SHIN, Yong Woon Yeo | 2025-01-14 |