Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351698 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Kenshiro FUKUDA, Yoshihiro Yoneda, Tomohiro Ishino, Tetsuro Sato | 2025-07-08 |
| 12297354 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Kenshiro FUKUDA, Toshifumi Matsushima | 2025-05-13 |