Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297354 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi, Kenshiro FUKUDA | 2025-05-13 |