Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351698 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Toshihiro Hosoi, Kenshiro FUKUDA, Yoshihiro Yoneda, Tetsuro Sato | 2025-07-08 |