Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424516 | Monolithic conductive column in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2025-09-23 |
| 12424517 | Monolithic conductive cylinder in a semiconductor device and associated methods | Wei Zhou, Kyle K. Kirby, Kunal R. Parekh | 2025-09-23 |
| 12300570 | Grindable heat sink for multiple die packaging | Wei Zhou, Kyle K. Kirby | 2025-05-13 |
| 12278202 | Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods | Bharat Bhushan, Akshay N. Singh, Debjit Datta, Eiichi Nakano | 2025-04-15 |
| 12255163 | Bond pads for semiconductor die assemblies and associated methods and systems | Bharat Bhushan, Akshay N. Singh, Keizo Kawakita | 2025-03-18 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2025-01-14 |