Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347797 | Apparatus, semiconductor device, and redistribution layer structure thereof | Shigeru Sugioka | 2025-07-01 |
| 12255163 | Bond pads for semiconductor die assemblies and associated methods and systems | Bharat Bhushan, Akshay N. Singh, Bret K. Street | 2025-03-18 |
| 12217816 | Semiconductor wiring device and method | Hidenori Yamaguchi | 2025-02-04 |
| 12211757 | Semiconductor device and method of forming the same | Haruka Momota, Koji Yasumori | 2025-01-28 |