Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424574 | Polymer coated semiconductor devices and hybrid bonding to form semiconductor assemblies | Wei Zhou, Ying-Ta Chiu | 2025-09-23 |
| 12362311 | Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods | Mark E. Tuttle | 2025-07-15 |
| 12300622 | Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication | — | 2025-05-13 |
| 12278202 | Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods | Bharat Bhushan, Akshay N. Singh, Bret K. Street, Debjit Datta | 2025-04-15 |
| 12243610 | Memory with parallel main and test interfaces | James B. Johnson, Kunal R. Parekh, Brent Keeth, Amy R. Griffin | 2025-03-04 |
| 12237299 | Systems and methods for direct bonding in semiconductor die manufacturing | Chia-Jung Hsu | 2025-02-25 |
| 12199068 | Methods of forming microelectronic device assemblies and packages | Owen R. Fay, Randon K. Richards, Aparna U. Limaye, Dong Soon Lim, Chan H. Yoo +2 more | 2025-01-14 |