Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417998 | Procedure to enable die rework for hybrid bonding | Guan Huei See | 2025-09-16 |
| 12405892 | Electronic apparatus and command accessing method thereof having power saving mechanism | Jui-Yuan Lin | 2025-09-02 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 |
| 12237186 | On-board cleaning of tooling parts in hybrid bonding tool | Ruiping Wang, Guan Huei See, Ananthkrishna Jupudi, Praveen Kumar Choragudi | 2025-02-25 |