Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424446 | Silicon (Si) dry etch for die-to-wafer thinning | Guan Huei See, ChangBum YONG, Prayudi Lianto, Cheng-ko J. Sun | 2025-09-23 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Guan Huei See, Chang Bum Yong | 2025-07-29 |