Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424446 | Silicon (Si) dry etch for die-to-wafer thinning | ChangBum YONG, Prayudi Lianto, Cheng-ko J. Sun, Arvind Sundarrajan | 2025-09-23 |
| 12417998 | Procedure to enable die rework for hybrid bonding | Ying Wang | 2025-09-16 |
| 12374586 | Methods of TSV formation for advanced packaging | Peng Suo, Ying Wang, Chang Bum Yong, Arvind Sundarrajan | 2025-07-29 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |
| 12237186 | On-board cleaning of tooling parts in hybrid bonding tool | Ruiping Wang, Ying Wang, Ananthkrishna Jupudi, Praveen Kumar Choragudi | 2025-02-25 |