Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388049 | High connectivity device stacking | Kurtis Leschkies, Han-Wen Chen, Giback Park, Kyuil Cho, Jeffrey L. Franklin +1 more | 2025-08-12 |
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk +4 more | 2025-07-29 |
| 12358073 | Method and apparatus for laser drilling blind vias | Wei-Sheng Lei, Kurtis Leschkies, Roman Gouk, Visweswaren Sivaramakrishnan | 2025-07-15 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Guan Huei See, Giback Park, Giorgio Cellere, Diego Tonini +2 more | 2025-07-08 |