Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347804 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Lin Hou, Peter Rabkin, Masaaki Higashitani, Rahul Sharangpani | 2025-07-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347804 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Lin Hou, Peter Rabkin, Masaaki Higashitani, Rahul Sharangpani | 2025-07-01 |