Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412854 | Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same | Linghan Chen | 2025-09-09 |
| 12347804 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani, Rahul Sharangpani | 2025-07-01 |
| 12261227 | Thin film transistor, display substrate and display device with reduced leakage current | Chenglong Wang, Yezhou Fang, Feng Li, Lei Yao, Lei Yan +6 more | 2025-03-25 |