Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347804 | Bonded assembly including interconnect-level bonding pads and methods of forming the same | Lin Hou, Yangyin Chen, Masaaki Higashitani, Rahul Sharangpani | 2025-07-01 |
| 12349353 | Three-dimensional nor array and method of making the same | Masaaki Higashitani, Hiroyuki Kinoshita, Satoshi Shimizu, Yanli Zhang, Johann Alsmeier | 2025-07-01 |
| 12342543 | Three-dimensional nor array and method of making the same | Masaaki Higashitani, Hiroyuki Kinoshita | 2025-06-24 |
| 12289887 | Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making the same | Masaaki Higashitani | 2025-04-29 |
| 12245425 | Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof | Masaaki Higashitani | 2025-03-04 |
| 12219756 | Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof | Masaaki Higashitani | 2025-02-04 |