Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394756 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2025-08-19 |
| 12327817 | ASIC package with photonics and vertical power delivery | Nam Hoon Kim, Teckgyu Kang, Ryohei Urata | 2025-06-10 |
| 12315860 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Teckgyu Kang, Yujeong Shim | 2025-05-27 |
| 12308543 | Structure for optimal XPU socket compression | William Frank Edwards, Xu Zuo, Ryohei Urata, Melanie Beauchemin, Shinnosuke Yamamoto +2 more | 2025-05-20 |
| 12278217 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Houle Gan, Yujeong Shim, Mikhail Popovich, Teckgyu Kang | 2025-04-15 |
| 12278160 | Methods and heat distribution devices for thermal management of chip assemblies | Yuan Li, Zhi Yang | 2025-04-15 |
| 12274079 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Teckgyu Kang, Scott Kirkman | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2025-03-04 |