Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394756 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2025-08-19 |
| 12327817 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Nam Hoon Kim, Ryohei Urata | 2025-06-10 |
| 12315860 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Woon-Seong Kwon, Yujeong Shim | 2025-05-27 |
| 12278217 | Backside integrated voltage regulator for integrated circuits | Namhoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2025-04-15 |
| 12274079 | Deep trench capacitors embedded in package substrate | Nam Hoon Kim, Scott Kirkman, Woon-Seong Kwon | 2025-04-08 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2025-03-04 |