Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Padam Jain, Yingshi Tang, Sue Yun Teng, Nicholas Chao Wei Wong, Kieran Miller +1 more | 2025-09-23 |
| 12315782 | Spring loaded compliant coolant distribution manifold for direct liquid cooled modules | Madhusudan K. Iyengar, Connor Burgess, Padam Jain, Jorge Padilla, Feini Zhang +1 more | 2025-05-27 |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Melanie Beauchemin, Padam Jain +6 more | 2025-03-04 |