Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Emad Samadiani, Padam Jain, Sue Yun Teng, Nicholas Chao Wei Wong, Kieran Miller +1 more | 2025-09-23 |