Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424509 | Compliant pad spacer for three-dimensional integrated circuit package | Emad Samadiani, Padam Jain, Yingshi Tang, Nicholas Chao Wei Wong, Kieran Miller +1 more | 2025-09-23 |
| 12243804 | Cooling heatshield for clamshell BGA rework | — | 2025-03-04 |