Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322730 | Wafer reconstitution and die-stitching | Sanjay Dabral, Jun Zhai, Kwan-Yu Lai, Kunzhong Hu | 2025-06-03 |
| 12261132 | Structure and method for sealing a silicon IC | Sanjay Dabral, SivaChandra Jangam, Jun Zhai, Kunzhong Hu | 2025-03-25 |