Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Yikang Deng, Yifan Kao, Jun Chung Hsu | 2025-06-03 |
TK
Taegui Kim
Overall (2025): #199,740 of 469,880Top 45%
1
Patents 2025