Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Yikang Deng, Taegui Kim, Yifan Kao | 2025-06-03 |
JH
Jun Chung Hsu
Overall (2025): #329,285 of 469,880Top 75%
1
Patents 2025