Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Yikang Deng, Taegui Kim, Jun Chung Hsu | 2025-06-03 |
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Yifan Kao
Overall (2025): #163,811 of 469,880Top 35%
1
Patents 2025