Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431403 | Semiconductor package including thermal interface material (TIM) layers on semiconductor chips | Kiwook Jung, Jaechoon Kim, Seunggeol Ryu | 2025-09-30 |
| 12388048 | Semiconductor package comprising heat spreader | Youngdeuk Kim, Jaechoon Kim, Taehwan Kim, Kyungsuk Oh | 2025-08-12 |