Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249599 | Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring | Wei Chen, Jie Zhao, Jun Zhai, Po-Hao Chang, Ying-Chieh Ke +1 more | 2025-03-11 |
HL
Hsien-Che Lin
Overall (2025): #365,410 of 469,880Top 80%
1
Patents 2025