| 12400913 |
Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabrication |
Manish Chandhok, Elijah V. Karpov, Mohit K. HARAN, Reken Patel, Charles H. Wallace +5 more |
2025-08-26 |
| 12381161 |
Backside wafer treatments to reduce distortions and overlay errors during wafer chucking |
Tayseer Mahdi, Grant Kloster |
2025-08-05 |
| 12341061 |
Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication |
Rami Hourani, Gopinath Bhimarasetti, James M. Blackwell |
2025-06-24 |
| 12305437 |
Hinge assembly |
— |
2025-05-20 |
| 12293913 |
Directed self-assembly enabled subtractive metal patterning |
Gurpreet Singh, Richard E. Schenker, Nityan NAIR, Nafees Kabir, Gauri Nabar +7 more |
2025-05-06 |
| 12266527 |
Directed self-assembly enabled patterning over metal layers using assisting features |
Gurpreet Singh, Nityan NAIR, Nafees Kabir, Eungnak Han, Xuanxuan Chen +6 more |
2025-04-01 |
| 12237223 |
Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication |
Paul A. Nyhus, Charles H. Wallace, Manish Chandhok, Mohit K. HARAN, Gurpreet Singh +5 more |
2025-02-25 |
| 12230536 |
Self-assembled guided hole and via patterning over grating |
Eungnak Han, Manish Chandhok, Gurpreet Singh |
2025-02-18 |
| 12218052 |
Advanced lithography and self-assembled devices |
Richard E. Schenker, Robert L. Bristol, Kevin Lin, James M. Blackwell, Marie Krysak +6 more |
2025-02-04 |