Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412838 | Integrated circuit structure with filled recesses | Kevin Lin, Nafees Kabir, Rami Hourani | 2025-09-09 |
| 12341061 | Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication | Florian Gstrein, Rami Hourani, Gopinath Bhimarasetti | 2025-06-24 |
| 12260296 | Diamondoid materials in quantum computing devices | David J. Michalak, John J. Plombon, James S. Clarke | 2025-03-25 |
| 12218052 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, Florian Gstrein, Marie Krysak +6 more | 2025-02-04 |