Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205874 | Semiconductor package with wire bond joints | Joel Feliciano Del Rosario, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2025-01-21 |
MB
Mohd Kahar Bajuri
Overall (2025): #273,861 of 469,880Top 60%
1
Patents 2025