Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266628 | Semiconductor package having a metal clip and related methods of manufacturing | Engku Izyan Munirah E Afandi, Wee Peng Chong | 2025-04-01 |
| 12205874 | Semiconductor package with wire bond joints | Mohd Kahar Bajuri, Thai Kee Gan, Mohd Afiz Hashim, Mei Fen Hiew | 2025-01-21 |