MH

Mohd Afiz Hashim

Infineon Technologies Ag: 1 patents #187 of 674Top 30%
📍 Shah Alam, MY: #1 of 4 inventorsTop 25%
Overall (2025): #273,403 of 469,880Top 60%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12205874 Semiconductor package with wire bond joints Mohd Kahar Bajuri, Joel Feliciano Del Rosario, Thai Kee Gan, Mei Fen Hiew 2025-01-21