Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431408 | TSV and backside power distribution structure | Ruilong Xie | 2025-09-30 |
| 12300615 | Infrared debond damage mitigation by copper fill pattern | Qianwen Chen, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky, Katsuyuki Sakuma +1 more | 2025-05-13 |
| 12199059 | Sintering a nanoparticle paste for semiconductor chip join | Katsuyuki Sakuma | 2025-01-14 |