QC

Qianwen Chen

IBM: 1 patents #1,197 of 3,866Top 35%
📍 Chappaqua, NY: #28 of 54 inventorsTop 55%
🗺 New York: #2,841 of 9,062 inventorsTop 35%
Overall (2025): #249,309 of 469,880Top 55%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12300615 Infrared debond damage mitigation by copper fill pattern Mukta G. Farooq, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky, Katsuyuki Sakuma +1 more 2025-05-13