Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424549 | Skip-level TSV with hybrid dielectric scheme for backside power delivery | Nicholas Anthony Lanzillo, Ruilong Xie, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-23 |
| 12424557 | Dual structured buried rail | Nicholas Anthony Lanzillo, Ruilong Xie, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-23 |
| 12412836 | Backside power plane | Ruilong Xie, Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger | 2025-09-09 |
| 12334442 | Dielectric caps for power and signal line routing | Nicholas Anthony Lanzillo, Ruilong Xie, Lawrence A. Clevenger, Hosadurga Shobha | 2025-06-17 |
| 12261056 | Top via patterning using metal as hard mask and via conductor | Nicholas Anthony Lanzillo, Hosadurga Shobha, Lawrence A. Clevenger, Chanro Park | 2025-03-25 |
| 12218003 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha | 2025-02-04 |