Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Kuldeep Saxena, Devarajan Balaraman | 2025-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Kuldeep Saxena, Devarajan Balaraman | 2025-02-11 |