Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224218 | Semiconductor packages with increased power handling | Geza Dezsi, Brice McPherson | 2025-02-11 |
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Sayan Seal, Kuldeep Saxena | 2025-02-11 |
| 12205827 | Electronic device with top side pin array and manufacturing method thereof | Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne | 2025-01-21 |
| D1056862 | Semiconductor package | Geza Dezsi, Brice McPherson | 2025-01-07 |