Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224233 | Packaged electronic devices having dielectric substrates with thermally conductive adhesive layers | Sayan Seal, Devarajan Balaraman | 2025-02-11 |
| 12199045 | Power semiconductor package with improved performance | Guy Moxey | 2025-01-14 |