Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255197 | Package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko | 2025-03-18 |
| 12230661 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Sung Kyu Kim +1 more | 2025-02-18 |