Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327779 | Semiconductor chip including through electrode, and semiconductor package including the same | Ho Young SON, Mi Seon LEE | 2025-06-10 |
| 12255126 | Semiconductor devices including substrates bonded to each other and methods for fabricating the same | Mi Seon LEE, Jong Hoon Kim | 2025-03-18 |
| 12230661 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2025-02-18 |
| 12221680 | Cryogenic austenitic high-manganese steel having excellent corrosion resistance, and manufacturing method therefor | Un-Hae Lee, Dong-Ho Lee, Sang-Deok Kang | 2025-02-11 |