Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255197 | Package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2025-03-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255197 | Package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2025-03-18 |