Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315828 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Chih-Cheng Lee, Min-Yao CHEN | 2025-05-27 |
| 12300677 | Semiconductor device package including stress buffering layer | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2025-05-13 |