Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136599 | Three-dimensional memory devices and fabricating methods thereof | He Chen, Shu Wu, Zhen Pan, Yi Zhao, Ziqun Hua | 2024-11-05 |
| 12133386 | Contact pads of three-dimensional memory device and fabrication method thereof | Yongqing Wang | 2024-10-29 |
| 12089406 | Three-dimensional memory device comprising contact pads exposed by an opening passing through layer stack and fabrication method thereof | Yongqing Wang | 2024-09-10 |
| 12080697 | Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures | Shiqi Huang, Wei Liu, Bater Chelon | 2024-09-03 |
| 11978719 | Metal-dielectric bonding method and structure | — | 2024-05-07 |