Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136599 | Three-dimensional memory devices and fabricating methods thereof | Shu Wu, Zhen Pan, Siping Hu, Yi Zhao, Ziqun Hua | 2024-11-05 |
| 12033966 | Contact pads of three-dimensional memory device and fabrication method thereof | Liang Xiao, Yongqing Wang, Shu Wu | 2024-07-09 |
| 11956958 | Method for fabricating three-dimensional semiconductor device using buried stop layer in substrate | — | 2024-04-09 |