Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080697 | Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures | Shiqi Huang, Wei Liu, Siping Hu | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080697 | Method for forming a three-dimensional (3D) memory device having bonded semiconductor structures | Shiqi Huang, Wei Liu, Siping Hu | 2024-09-03 |