Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166012 | Flip-chip stacking structures and methods for forming the same | Xinru Zeng, Meng Wang, Baohua Zhang, Houde Zhou | 2024-12-10 |
| 12131924 | Method for processing semiconductor wafers | Liquan Cai, Houde Zhou | 2024-10-29 |
| 12121995 | Laser system for dicing semiconductor structure and operation method thereof | Liquan Cai, Houde Zhou | 2024-10-22 |
| 12125827 | Chip package structure and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2024-10-22 |
| 12106985 | Laser dicing system and method for dicing semiconductor structure including cutting street | Liquan Cai, Houde Zhou | 2024-10-01 |
| 11866332 | Carbon nanoparticle-porous skeleton composite material, its composite with lithium metal, and their preparation methods and use | Feng Guo, Yalong WANG, Tuo Kang, Chenghao Liu, Yanbin Shen +2 more | 2024-01-09 |