Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166012 | Flip-chip stacking structures and methods for forming the same | Peng Chen, Meng Wang, Baohua Zhang, Houde Zhou | 2024-12-10 |
| 12125827 | Chip package structure and manufacturing method thereof | Peng Chen, Houde Zhou | 2024-10-22 |