Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131924 | Method for processing semiconductor wafers | Peng Chen, Houde Zhou | 2024-10-29 |
| 12121995 | Laser system for dicing semiconductor structure and operation method thereof | Peng Chen, Houde Zhou | 2024-10-22 |
| 12106985 | Laser dicing system and method for dicing semiconductor structure including cutting street | Peng Chen, Houde Zhou | 2024-10-01 |