Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Yuyun Lou, Junrong Yan | 2024-02-13 |
| 11894343 | Vertical semiconductor device with side grooves | Xianlu Cui, Junrong Yan, Wei Liu | 2024-02-06 |